SEMIL-1300 series is a rugged IP67 embedded computer with robust M12 I/O connectors in a standard 2U 19″ half-rack form factor enclosure. Powered by Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU and coupled with workstation-grade Intel® C246 chipset, it supports up to 64 GB DDR4 ECC/non-ECC memory and offers flexible mounting options to wall or rack-mount up to two SEMILs side by side. SEMIL-1300 IP67 embedded computer’s incorporates best-in-class passive thermal design for proven -40 °C to 70 °C fanless operation. It offers a variety of I/O connectivity utilizing M12 connectors that are reliably robust, cost-effective and can be obtained off-the-shelf. There are also generic I/Os with screw-lock mechanisms to guarantee an extreme-rugged connection in shock and vibration environments. It has four 802.3at PoE+ ports, each supplying 25W of power to the connected device such as an IP or GigE camera. SEMIL-1300 is designed with 4G/5G and WiFi5/WiFi6 wireless connectivity in mind and it supports 8-48V wide-range DC input with ignition power control for in-vehicle use while complying with EN 50155. In addition, SEMIL-1311J IP67 embedded computer is equipped with Neousys’ patented SuperCAP-based UPS containing 2500 watt-second stored energy to sustain and safely shut down the system during unforeseen power outages. It is the perfect solution for data protection and applications in unstable power environments. With a standard half-rack design, proven wide temperature operation capability, protected against shock/ vibration and power interruption, Neousys’ SEMIL-1300 IP67 embedded computer is the ideal robust solution for extreme-rugged deployment. Edge computing processes data locally, instead of in the cloud or data center, it minimizes latency and bandwidth needs, allowing for real-time feedback and decision-making. The SEMIL-1300 IP67 embedded computer being so rugged is thus the best bet for extremely rugged Edge applications.
Name | Action |
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| Download |
SEMIL-1301 | SEMIL-1311J | |
System Core | ||
Processor | Supporting Intel® Xeon® E and 9th/ 8th-Gen CPU (LGA1151 socket) | |
– Xeon E 2278GE (8C/16T) / 2278GEL (8C/16T) / 2176G (6C/12T) | ||
– i7-9700E, i7-9700TE, i7-8700, i7-8700T | ||
– i5-9500E, i5-9500TE, i5-8500, i5-8500T | ||
– i3-9100E, i3-9100TE, i3-8100, i3-8100T | ||
Chipset | Intel® C246 platform controller hub | |
Graphics | Integrated Intel® UHD Graphics 630 | |
Memory | Up to 64 GB ECC/ non-ECC DDR4-2666/ 2400 SDRAM | |
(two SODIMM sockets) | ||
AMT | Supports AMT 12.0 | |
TPM | Supports TPM 2.0 | |
I/O Interface | ||
PoE+ | 1x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I219 (M12 X-coded) | |
3x IEEE 802.3at (25.5W) Gigabit PoE+ ports by Intel® I210 (M12 X-coded) | ||
10 GbE Port(Build Option) | Optional: 1x 10 GbE port by Intel® X550AT controller (M12 X-coded)** | |
Native Video Port | 1x VGA (M12 A-coded), supporting 1920 x 1200 resolution | |
1x DisplayPort connector, supporting 4096 x 2304 resolution | ||
Series Port | 2x 3-wires RS-232 ports COM1 & COM2 (M12 A-coded) | |
1x software-programmable RS-232/ 422/ 485 port (COM3, DB9) | ||
1x RS-232 port (COM4, DB9) | ||
USB | 3x USB 3.1 Gen1 | |
2x USB 2.0 (M12 A-coded) | ||
1x USB 2.0 (internal) | ||
Audio | 1x 3.5 mm jack for mic-in and speaker-out | |
Storage Interface | ||
SATA HDD | 2x Internal SATA port for 2.5″ HDD/ SSD installation, supporting RAID 0/ 1 | |
mSATA | 2x full-size mSATA port (mux with mini-PCIe) | |
M.2 | 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation | |
Expansion Bus | ||
Mini PCI-E | 2x full-size mini PCI Express sockets (mux with mSATA) | |
1x M.2 3042/ 3052 B key socket for selected M.2 4G/ 5G module | ||
1x M.2 2242/ 2252 E key for selected WiFi module | ||
Power Supply | ||
DC Input | 8V to 48V DC input | |
Ignition Control | Built-in ignition power control | |
Power Backup | ||
Capacity | – | 2500 watt-second |
Mechanical | ||
Dimension | 220mm (W) x 310mm (D) x 86.5mm (H) (excl. rack-mount bracket) | |
Weight | 5.8 kg | 6 kg |
Mounting | Rack-mounting and wall-mounting | |
Environmental | ||
Operating Temperature | with 35W CPU | |
-40°C ~ 70°C **** | ||
with >= 65W CPU | ||
-40°C ~ 70°C ***/ **** (configured as 35W TDP mode) | ||
-40°C ~ 50°C ***/ **** (configured as 65W TDP mode) | ||
Storage Temperature | -40°C ~85°C | |
Humidity | 10%~90% , non-condensing | |
Vibration | MIL-STD-810G, Method 514.7, Category 4 | |
Shock | MIL-STD-810G, Method 516.7, Procedure I | |
EMC | EN-50155, CE/FCC Class A, according to EN 55032 & EN 55035 |
Model No. | Model Description |
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SEMIL-1301 | Half-Rack Rugged Fanless Computer supporting Intel® Xeon® E or 9th/ 8th-Gen Core™ processor with M12 I/Os |
SEMIL-1311J | Half-Rack Rugged Fanless Computer supporting Intel® Xeon® E or 9th/ 8th-Gen Core™ processor with M12 I/Os and SuperCAP UPS |