System Core |
Processor |
Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor |
Graphics |
Integrated Intel® UHD Graphics |
Memory |
Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket |
Panel I/O Interface |
Ethernet |
3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers |
POE |
Optional IEEE 802.3at PoE+ on port #2 and #3 |
Video Port |
2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz |
USB |
2x USB 3.1 Gen1 (5 Gbps) ports |
2x USB 2.0 ports |
Serial Port |
1x software-programmable RS-232/422/485 ports (COM1) |
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2) |
Audio |
Optional 1x 3.5 mm jack for mic-in and speaker-out |
Internal Expansion Bus |
M.2 E key |
1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module |
Expandable I/O |
1x MezIO™ expansion port for Neousys MezIO™ modules |
Storage Interface |
M.2 M key |
1x M.2 2280 SATA interface |
Power Supply |
DC Input |
1x 3-pin pluggable terminal block for 8V to 35V DC input |
Remote Ctrl. & LED Output |
1x 10-pin (2×5) pin header for remote on/off control and status LED output |
Serial Port |
2x software-programmable RS-232/422/485 ports (COM1/ COM2) |
2x RS-232 ports (COM3/ COM4) |
Audio |
1x 3.5 mm jack for mic-in and speaker-out |
Internal Expansion Bus |
Mini PCI-E |
1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA) |
M.2 |
1x M.2 2242 B key socket with dual front-accessible SIM sockets |
Expandable I/O |
1x MezIO |
Storage interface |
SATA HDD |
1x front-accessible, hot-swappable 2.5″ HDD/SSD tray |
1x internal SATA port for 2.5″ HDD/SSD installation, supporting RAID 0/ 1 |
M.2 |
1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation |
mSATA |
1x full-size mSATA port (mux with mini-PCIe) |
Power Supply |
DC Input |
1x 3-pin pluggable terminal block for 8V to 35V DC input |
Remote Ctrl. & Status Output |
1x 3-pin pluggable terminal block for remote control and PWR LED output |
Mechanical |
Dimension |
240 mm (W) x 225 mm (D) x 79 mm (H) |
Weight |
3.1 kg |
Mounting |
Wall-mounting (standard) or DIN-Rail mounting (optional) |
Environmental |
Operating temperature |
with 35W CPU |
-25°C ~ 70°C ** |
with 65W CPU |
-25°C ~ 70°C */** (configured as 35W TDP) |
-25°C ~ 50°C */** (configured as 65W TDP) |
Storage temperature |
-40°C ~ 85°C |
Humidity |
10% ~ 90% , non-condensing |
Vibration |
Operating, MIL-STD-810G, Method 514.6, Category 4 |
Shock |
Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
EMC |
CE/FCC Class A, according to EN 55032 & EN 55024 |
Safety |
UL62368-1, IEC62368-1 |