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POC-400 Series

POC-400 Series

Intel® Elkhart Lake Atom® x6425E Ultra-compact Fanless Embedded PC with PoE+ ports

POC-400 is an ultra-compact embedded PC for industrial & other applications where space is a cnstraint. It utilizes the latest Intel® Elkhart

Lake platform Atom® x6425E 4-core CPU that can deliver 1.8x CPU and 2x GPU performance improvement, compared to the previous generation.


In addition to the performance boost, POC-400 features an ultra-compact design measuring just 56 x 108 x 153 mm, which can easily fit into restricted spaces. The system comes with a DIN-rail mounting chassis and an abundance of front-access I/O interfaces. Featuring three 2.5GBASE-T Ethernet ports with IEEE 802.3 PoE+ capability, they provide higher data bandwidth for devices such as NBASE-T cameras and is backward-compatible with 1000/100/10 Mbps Ethernet. It also has two 4K DisplayPort, 2x USB3.1 Gen1, 2x USB 2.0 and COM ports for general industrial applications.


Supporting Neousys’ proprietary MezIO™ interface for function expansion, one can add functions such as isolated DIO, RS-232/422/485, ignition control and 4G/ 5G by installing a MezIO™ module. Moreover, POC-400 comes with an internal M.2 E key socket for a Google TPU or an Intel® Movidius VPU module to transform it into a lightweight AI inference platform at the edge.


Combining the new 10nm Atom® CPU, 2.5G Ethernet ports, PoE+ and ultra-compact enclosure with function expansion capabilities, POC-400 is a ultra-compact embedded PC, a versatile embedded controller that can fuel various industrial applications.


Datasheet(1)
Name Action
POC-400 Series
  • Features
  • Specifications
  • Ordering info
  • Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
  • Rugged -25 °C to 70 °C fanless operation
  • 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
  • M.2 2280 M key SATA interface
  • 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
  • Front I/O access DIN-mounting design
  • Dual DP display outputs supporting 4096 x 2160 resolution
  • MezIO™ compatible
System Core
Processor Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor
Graphics Integrated Intel® UHD Graphics
Memory Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Panel I/O Interface
Ethernet 3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers
POE Optional IEEE 802.3at PoE+ on port #2 and #3
Video Port 2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz
USB 2x USB 3.1 Gen1 (5 Gbps) ports
2x USB 2.0 ports
Serial Port 1x software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Audio Optional 1x 3.5 mm jack for mic-in and speaker-out
Internal Expansion Bus
M.2 E key 1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module
Expandable I/O 1x MezIO™ expansion port for Neousys MezIO™ modules
Storage Interface
M.2 M key 1x M.2 2280 SATA interface
Video Port 1x VGA connector, supporting 1920 x 1200 resolution
1x DVI-D connector, supporting 1920 x 1200 resolution
1x DisplayPort connector, supporting 4096 x 2304 resolution
Serial Port 2x software-programmable RS-232/422/485 ports (COM1/ COM2)
2x RS-232 ports (COM3/ COM4)
Audio 1x 3.5 mm jack for mic-in and speaker-out
Internal Expansion Bus
Mini PCI-E 1x full-size mini PCI Express socket with internal SIM socket (mux with mSATA)
M.2 1x M.2 2242 B key socket with dual front-accessible SIM sockets
Expandable I/O 1x MezIO
Storage interface
SATA HDD 1x front-accessible, hot-swappable 2.5″ HDD/SSD tray
1x internal SATA port for 2.5″ HDD/SSD installation, supporting RAID 0/ 1
M.2 1x M.2 2280 M key socket (PCIe Gen3/ x4) for NVMe SSD or Intel® OptaneTM memory installation
mSATA 1x full-size mSATA port (mux with mini-PCIe)
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8V to 35V DC input
Remote Ctrl. & Status Output 1x 3-pin pluggable terminal block for remote control and PWR LED output
Mechanical
Dimension 240 mm (W) x 225 mm (D) x 79 mm (H)
Weight 3.1 kg
Mounting Wall-mounting (standard) or DIN-Rail mounting (optional)
Environmental
Operating temperature with 35W CPU
-25°C ~ 70°C **
with 65W CPU
-25°C ~ 70°C */** (configured as 35W TDP)
-25°C ~ 50°C */** (configured as 65W TDP)
Storage temperature -40°C ~ 85°C
Humidity 10% ~ 90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC CE/FCC Class A, according to EN 55032 & EN 55024
Safety UL62368-1, IEC62368-1
Available Models
Model No. Description
POC-400 Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 1x 2.5GbE, 2x 2.5G PoE+ and 2x USB 3.1 Gen1
POC-410 Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 3x 2.5GbE and 2x USB 3.1 Gen1
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