SCM330
SMARC Module with Intel® Core™/Pentium®/Celeron® or Intel Atom® Processors x7000 Series
Features
- Intel® Core™/Pentium®/Celeron® or Intel Atom® processors x7000 series
- LPDDR5-4800 with IBECC support, up to 16GB
- Up to 4 lanes of PCI Express
- 1 SATA Gen3
- 2 USB 3.2 Gen.1 and 6 USB 2.0
- Supports eMMC5.1 for up to 128GB of memory
- Supports fTPM
- SMARC2.1.1 pinout compliance
- DDR5
- USB 3.2 Gen.1
- Triple-View
- All Solid Caps
- AiRD Low Power
- Wide Temp
Computer
CPUIntel® Core™/Pentium®/Celeron® or Intel Atom® processors x7000 series
System MemoryLPDDR5-4800 with IBECC support, up to 16GB
ChipsetSoC integrated
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0 to 65535 sec.
Storage
StorageeMMC5.1, up to 128GB
Expansion
Expansion Interface3 x PCIe x1 (default) or 1 x PCIe x4 or 4 x PCIe x1 (optional)
Display
Display Interface1 x LVDS; 18/24-bit single/dual-channel (optional eDP 1.4b)
Display Interface1 x HDMI
Display Interface1 x DisplayPort/HDMI
I/o interfaces
SATA1x SATA Gen3
Ethernet2x 10/100/1000/2500Mbps Ethernet with Intel® I226 with support for Wake-on-LAN and PXE Boot ROM
AudioHDA link interface to baseboard for codec
USB2x USB 3.2 Gen1, 6x USB 2.0
Serial4x UART, 1x SPI, 1x GSPI (optional 1x eSPI)
TPMfTPM
SMBusYes
I2C2x I2C
CAN bus2x CAN bus
GPIO7-CH in and 7-CH out (shared with Fan & HDA)
Smart BatteryYes
Hardware MonitoringYes
Power
Power InputATX: Vin, VSB; AT: Vin
VoltageVin: 4.75 to 5.25V, RTC battery: 2.0V to 3.3V
BatteryLithium Yes
Physical
Dimensions82x50mm
Board Thickness1.2mm
Environmental
Operating TemperatureIndustrial: -40℃ to +85℃ (-40℃ to +185℃) with a system thermal solution; Standard: 0℃ to +60℃ (32℃ to +140℃) with operation
Humidity10% to 95% relative humidity, non-condensing
Vibration Endurance3.5Grms
Computer
CPUIntel® Core™/Pentium®/Celeron® or Intel Atom® processors x7000 series
System MemoryLPDDR5-4800 with IBECC support, up to 16GB
ChipsetSoC integrated
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0 to 65535 sec.
Storage
StorageeMMC5.1, up to 128GB
Expansion
Expansion Interface3 x PCIe x1 (default) or 1 x PCIe x4 or 4 x PCIe x1 (optional)
Display
Display Interface1 x LVDS; 18/24-bit single/dual-channel (optional eDP 1.4b)
Display Interface1 x HDMI
Display Interface1 x DisplayPort/HDMI
I/o interfaces
SATA1x SATA Gen3
Ethernet2x 10/100/1000/2500Mbps Ethernet with Intel® I226 with support for Wake-on-LAN and PXE Boot ROM
AudioHDA link interface to baseboard for codec
USB2x USB 3.2 Gen1, 6x USB 2.0
Serial4x UART, 1x SPI, 1x GSPI (optional 1x eSPI)
TPMfTPM
SMBusYes
I2C2x I2C
CAN bus2x CAN bus
GPIO7-CH in and 7-CH out (shared with Fan & HDA)
Smart BatteryYes
Hardware MonitoringYes
Power
Power InputATX: Vin, VSB; AT: Vin
VoltageVin: 4.75 to 5.25V, RTC battery: 2.0V to 3.3V
BatteryLithium Yes
Physical
Dimensions82x50mm
Board Thickness1.2mm
Environmental
Operating TemperatureIndustrial: -40℃ to +85℃ (-40℃ to +185℃) with a system thermal solution; Standard: 0℃ to +60℃ (32℃ to +140℃) with operation
Humidity10% to 95% relative humidity, non-condensing
Vibration Endurance3.5Grms
